P024F048T12AL datasheet(13/14 Pages) VICOR

13 / 14 page

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V•I Chip Pre-Regulator Module

P024F048T12AL

Rev. 2.7

Page 13 of 14

Configuration Options

V•I Chip Pre-Regulator Module

2.95±0.07

[0.116±0.003]

NON-PLATED

THROUGH HOLE

SEE NOTE 1.

(2) PL

(4.37)

0.172

(11.37)

0.448

(7.00)

0.276

(36.50)

1.437

(18.25)

0.719

(2.510)

0.099

(31.48)

1.240

(39.50)

1.555

SEE NOTE 2.

DOTTED LINE

INDICATES VIC

POSITION

SEE NOTE 3

HEAT SINK PUSH-PIN HOLE PATTERN

( TOP SIDE SHOWN )

SEE NOTE 3

inch

(mm)

NOTES:

1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF

COPPER. ALL PCB LAYERS.

2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555].

THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING.

AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS.

3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;

ACTUAL LAND PATTERN MAY DIFFER.

DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN

HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.

4. DIMENSION ARE

Figure 23 — Hole location for push pin heat sink relative to V•I Chip

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