CS48DV2B Data Sheet

32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby

DS875F2

Copyright 2009 Cirrus Logic

11

CONFIDENTIAL

5.4 Power Supply Characteristics

(Measurements performed under operating conditions)

5.5 Thermal Data (48-Pin LQFP)

1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &

bottom layers.

2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &

bottom layers and 0.5-oz. copper covering 90 % of the internal power plane & ground plane layers.

3. To calculate the die temperature for a given power dissipation

T

θ

4. To calculate the case temperature for a given power dissipation

T

ψ

Parameter

Min

Typ

Max

Unit

Operational Power Supply Current:

VDDA: PLL operating

VDDIO: With most ports operating

Total Operational Power Dissipation:

Standby Power Supply Current:

VDD: Core and I/O not clocked

VDDA: PLL halted

VDDIO: All connected I/O pins 3-stated by other ICs in system

Total Standby Power Dissipation:

1. Dependent on application firmware and DSP clock speed.

-

-

-

-

-

-

-

203

8

27

480

100

1

50

348

-

-

-

-

-

-

-

mA

mA

mA

mW

μA

μA

μA

μW

Parameter

Symbol

Min

Typ

Max

Unit

Junction Temperature

-

-

125

°C

Thermal Resistance (Junction to Ambient)

Two-layer Board1

Four-layer Board2

θ

ja

-

-

63.5

54

-

-

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board3

Four-layer Board4

ψ

jt

-

-

0.70

0.64

-

-

°C / Watt