MCP73831-2ACISLASHMC datasheet(23/28 Pages) MICROCHIP

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DS21984E-page 19

MCP73831/2

APPENDIX A: REVISION HISTORY

Revision E (September 2008)

The following is the list of modifications:

Package Types: Changed DFN pinout diagram.

1.0 “Electrical Characteristics”: Changed

“Charge Impedance Range from 20 k

Ω to

67 k

Ω.

1.0 “Electrical Characteristics”: Misc. Format-

ting changes.

Section 2.0 “Typical Performance Curves”:

Updated Figure 2-4.

Section 3.0

“Pin

Description”:

Added

Exposed

Pad

table

and

added

Section 3.6 “Exposed Thermal Pad (EP)”.

Updated

Appendix A: “Revision History”

Added Land Patttern Package Outline Drawing

for 2x3 DFN package.

Pagination fixes throughout document per

Marcom Standards.

Revision D (April 2008)

The following is the list of modifications:

Changed Charge Termination Current Ratio to

8.5% minimum and 11.5% maximum.

Revision C (October 2007)

The following is the list of modifications:

Numerous edits throughout document.

Added note to Temperature Specifications table.

Updated Figure 2-4.

Revision B (March 2006)

The following is the list of modifications:

Added MCP73832 through document.

Revision A (November 2005)

• Original Release of this Document.

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