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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

HMC684LP4 / 684LP4E

v01.0408

BiCMOS MMIC MIXER W/ INTEGRATED

LO AMPLIFIER, 700 - 1000 MHz

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC684LP4

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H684

XXXX

HMC684LP4E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H684

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. PAD BURR LENGTH SHALL BE 0.15mm MAX.

PAD BURR HEIGHT SHALL BE 0.25mm MAX.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm

8. ALL GROUND LEADS AND GROUND PADDLE

MUST BE SOLDERED TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE

FOR SUGGESTED PCB LAND PATTERN.