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LA112B-2G-R1-PF Datasheet(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LA112B-2G-R1-PF Datasheet(HTML) 5 Page - LIGITEK electronics co., ltd. |
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5 / 6 page ![]() 120° 260° Time(sec) Temp(°C) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 3°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 260°C3sec Max Preheat 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 60 Seconds Max 3°/sec max 5°/sec max 25° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 PART NO. LA112B/2G-R1-PF |
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