Recommendations for processing

1. Ensure correct positioning of a ceramic capacitor on the solder pad.

2. Be careful when using casting, injection-molded and molding compounds and cleaning

agents. They can damage a capacitor.

3. Support a circuit board and reduce placement forces.

4. Do not straighten a board (manually) if it is distorted by soldering.

5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or

breaking).

6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or

snap-in components) because of the danger of bending and fracture.

7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that

components are not damaged.

8. Avoid excessive force when plugging a connector into a device soldered onto a board.

9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is

permissible for them (see chapter “Soldering directions”).

10. When soldering, select the softest solder profile possible (heating time, peak temperature,

cooling time) to avoid thermal stress and damage.

11. Ensure the correct solder meniscus height and solder quantity.

12. Ensure correct dosing of the cement.

13. Ceramic capacitors with external silver-palladium terminations are intended for conductive

adhesion - they are not suited for lead-free soldering processes.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Multilayer ceramic capacitors

C0G

Page 12 of 15

Please read Cautions and warnings and

Important notes at the end of this document.