TL(RM,RMM,SM,OM,YM)1052(T20)

2009-07-23

9

Packaging

These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture

absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering

and they should therefore be stored under the following conditions:

1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.

Temperature: 5

°C to 30°C

Humidity: 90% (max)

2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment

of 5°C to 30°C/70% RH or below.

3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to

pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.

After baking, use the baked devices within 72 hours, but perform baking only once.

Baking conditions: 60

±5°C, for 12 to 24 hours.

Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.

4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure

to prevent damage to the device from static electricity during the baking process.

5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do not

toss or drop the packed devices.

Mounting Method

Soldering

• Reflow soldering (example)

• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the

condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under the

above conditions.

• Perform the first reflow soldering in accordance with the above temperature profile and within 168 hours of opening

the package.

• Second time reflow

In case of second reflow soldering should be performed within 168 hours of the first reflow under the above conditions.

Storage conditions before the second reflow soldering: 5 to 30

°C, 70% RH max

• Do not perform flow soldering and dip soldering.

• Make any necessary soldering corrections manually.

(only once at each soldering point)

Soldering iron: Less than 25 W

Temperature: Less than 350

°C or less

Time:

within 3 s (Up to one time per place)

60 to 120 s

10 s max

240

°C max

4

°C/s max

140 to 160

°C

4

°C/s max

Time (s)

Temperature profile for Pb soldering (example)

Time (s)

Temperature profile for Pb-free soldering (example)

150 to 180

°C

4

°C/s max

5 s max

260

°C max

4

°C/s max

230

°C

60 to 120 s

(*)

(*)

(*)

(*)

(*)

(*)

(*)

(*)

max

(*)

max

(*)

max

(*)

30 to 50s max

(*)

max

(*)