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LTC4355CS Datasheet(PDF) 11 Page - Linear Technology |
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LTC4355CS Datasheet(HTML) 11 Page - Linear Technology |
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11 / 20 page  LTC4355 11 4355fe Figure 3. Layout Considerations S S S G D D D D D D D D G S S S LTC4355 FET FET Layout Considerations The following advice should be considered when laying out a printed circuit board for the LTC4355. The inputs to the servo amplifiers, IN1, IN2, and OUT should be connected as closely as possible to the MOSFETs’ terminals for good accuracy. Keep the traces to the MOSFETs wide and short. The PCB traces associated with the power path through the MOS- FETs should have low resistance (see Figure 3). For the DFN package, pin spacing may be a concern at voltages greater than 30V. Check creepage and clearance guidelines to determine if this is an issue. Use no-clean solder to minimize PCB contamination. APPLICATIONS INFORMATION |
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