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BAS516 Datasheet(PDF) 12 Page - NXP Semiconductors |
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BAS516 Datasheet(HTML) 12 Page - NXP Semiconductors |
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12 / 20 page  BAS16_SER_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 25 August 2008 12 of 20 NXP Semiconductors BAS16 series High-speed switching diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint BAS16H (SOD123F) Reflow soldering is the only recommended soldering method. Fig 20. Reflow soldering footprint BAS16J (SOD323F) 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste Dimensions in mm 0.5 (2 ×) 0.6 (2 ×) 0.6 (2 ×) 0.5 (2 ×) sod323f_fr |
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