IP4365CX11_1

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 — 26 March 2010

9 of 12

NXP Semiconductors

IP4365CX11

Integrated SIM card passive filter array and USB ESD protection

10. Abbreviations

11. Revision history

Table 8.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

peak reflow temperature

230

-

260

°C

time 1

soak time

60

-

180

s

time 2

time during T

≥ 250 °C

-

-

30

s

time 3

time during T

≥ 230 °C

10

-

50

s

time 4

time during T > 217

°C

30

-

150

s

time 5

-

-

540

s

dT/dt

rate of change of temperature

cooling rate

-

-

−6

°C/s

pre-heat

2.5

-

4.0

°C/s

Table 9.

Abbreviations

Acronym

Description

DUT

Device Under Test

EMI

ElectroMagnetic Interference

ESD

ElectroStatic Discharge

FR4

Flame Retard 4

IEC

International Electrotechnical Commission

ISO

International Organization for Standardization

NSMD

Non-Solder Mask Defined

NWA

NetWork Analyzer

PCB

Printed-Circuit Board

PCS

Personal Communication System

RF

Radio Frequency

RFI

Radio Frequency Interference

RoHS

Restriction of Hazardous Substances

SIM

Subscriber Identity Module

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

WLCSP

Wafer-Level Chip-Scale Package

Table 10.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

IP4365CX11_1

20100326

Product data sheet

-

-