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MPX5100AP Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc

Part # MPX5100AP
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  17 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPX5100AP Datasheet(HTML) 8 Page - Freescale Semiconductor, Inc

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MPX5100
Sensors
8
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder
Figure 6. Small Outline Package Footprint
Part Number
Case Type
Pressure (P1) Side Identifier
MPX5100A, MPX5100D
867
Stainless Steel Cap
MPX5100DP
867C
Side with Part Marking
MPX5100AP, MPX5100GP
867B
Side with Port Attached
MPXV5100GC6U
482A
Side with Port Attached
MPXV5100GC7U
482C
Side with Port Attached
MPXV5100DP
1351
Side with Part Marking
MPXV5100GP
1369
Side with Port Attached



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