MPXV7007DP datasheet(6/10 Pages) FREESCALE

6 / 10 page

MPXV7007

Sensors

Freescale Semiconductor

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluoro silicone gel

which protects the die from harsh media. The pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. Small Outline Package Footprint

Pressure Error Band

Pressure

Error (Max)

- 7 to 7 (kPa)

±0.5 (kPa)

Pressure (kPa)

0.5

0.4

0.2

–0.3

–0.4

–0.5

-7

0.3

0.1

–0.2

–0.1

Pressure

Error

(kPa)

Part Number

Case Type

Pressure (P1)

Side Identifier

MPXV7007GC6U/C6T1

482A

Side with Port Attached

MPXV7007GP

1369

Side with Port Attached

MPXV7007DP

1351

Side with Part Marking

MPXV7007G6U/T1

482

Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

SCALE 2:1

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