PIC16F57-ISLASHSP datasheet(77/88 Pages) MICROCHIP

77 / 88 page

DS41213D-page 75

PIC16F5X

28-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

.100 BSC

Top to Seating Plane

–

.250

Molded Package Thickness

.125

–

.195

Base to Seating Plane

.015

–

Shoulder to Shoulder Width

.590

–

.625

Molded Package Width

.485

–

.580

Overall Length

1.380

–

1.565

Tip to Seating Plane

.115

–

.200

Lead Thickness

.008

–

.015

Upper Lead Width

.030

–

.070

Lower Lead Width

.014

–

.022

Overall Row Spacing §

–

.700

NOTE 1

12 3

Microchip Technology Drawing C04-079B

PIC16F57-I/SP Datasheet(PDF) 77 Page - Microchip Technology

PIC16F57-I/SP Datasheet(HTML) 77 Page - Microchip Technology

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