S5F429PX02-LAB0 datasheet(17/18 Pages) SAMSUNG

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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA

S5F429PX02

PACKAGE DIMENSIONS

Figure 7. Package Dimensions

(Unit = mm)

2.50

R0.70

6.00¡¾0.10

10.00¡¾0.12

5.40¡¾0.10

7.40¡¾0.10

10.00¡¾0.12

4-R 0.30

(L/F CL)

4-R 0.50

(L/F CL)

4-R0.50

#14

0.46¡¾0.10

Glass

(7583)

1.27¡¾0.05

0.30¡¾0.10

1.27 x 6 = 7.62¡¾0.10

9.60¡¾0.12

NOTES :

1. Max. Leakage by Hellium Detector

:10

-8atm. cc/sec at 10-5 mmHg

2. Resistance Between Leads

:Above 10

100HM at 25¡É, 60% R>H

3. Insulation Resistance

:Electrical leakage shall not exceed 5

nano AMP at 100V D.C

4. Ceamic Material

:Min. 90% al

20 3 (black)

5. Lead Frame

- Coplanarity

:0.25 Max. (after L/F attach)

- Planarity

:0.076/mm, -0.102/mm

- Al clad

. Thickness

:5um to 10um (f or stamp)

. Thickness

:2.5um to 12.7um (for etch)

. Coverage

:Min. 0.762mm from lead tip

- Sn thickness

:4um to 20um

6. Flatness

- DIE attach pad

:Max. 0.051mm

- LID seal area

:Max. 0.051mm

7. Other

:In according to semi standards.

0.25

10.16¡¾0.30

9.46¡¾0.12

2.600

0.80¡¾0.15

0.35¡¾0.08

1.00¡¾0.08

0.90¡¾0.08

2O 3

90%Min. (black)

Alloy 42

( Inner AI

Outer Sn )

Ceramic Base

0.38

Glass

7583

Ceramicframe

2O3

90%Min. (black)

10.00¡¾0.12

Lead Frame

1.27¡¾0.25

4.13

S5F429PX02-LAB0 Datasheet(PDF) 17 Page - Samsung semiconductor

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