Data Sheet

512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash

SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040

SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040

21

©2010 Silicon Storage Technology, Inc.

S71150-14-000

01/10

PACKAGING DIAGRAMS

FIGURE 21: 32-lead Plastic Lead Chip Carrier (PLCC)

SST Package Code: NH

FIGURE 22: 48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm

SST Package Code: B3K

.040

.030

.021

.013

.530

.490

.095

.075

.140

.125

.032

.026

.032

.026

.029

.023

.453

.447

.553

.547

.595

.585

.495

.485

.112

.106

.042

.048

.048

.042

.015 Min.

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1

232

.400

BSC

32-plcc-NH-3

Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.

2. All linear dimensions are in inches (max/min).

3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.

4. Coplanarity: 4 mils.

.050

BSC

.050

BSC

Optional

Pin #1

Identifier

.020 R.

MAX.

R.

x 30˚

A1 CORNER

H G F E D C B A

A B C D E F G H

BOTTOM VIEW

TOP VIEW

SIDE VIEW

6

5

4

3

2

1

6

5

4

3

2

1

SEATING PLANE

0.35 ± 0.05

1.10 ± 0.10

0.12

6.00 ± 0.20

0.45 ± 0.05

(48X)

A1 CORNER

8.00 ± 0.20

0.80

4.00

0.80

5.60

48-tfbga-B3K-6x8-450mic-4

Note:

1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. Ball opening size is 0.38 mm (± 0.05 mm)

1mm