3

Recommended soldering methods - type-specific releases by EPCOS

3.1

Overview

Reflow soldering

Wave soldering

Type

Case size

SnPb

Lead-free

SnPb

Lead-free

CT... / CD...

0201/ 0402

Approved

Approved

No

No

CT... / CD...

0603 ... 2220

Approved

Approved

Approved

Approved

CN...

0603 ... 2220

Approved

No

Approved

No

Arrays

0405 ... 1012

Approved

Approved

No

No

ESD/EMI filters 0405, 0508

Approved

Approved

No

No

CU

3225, 4032

Approved

Approved

Approved

Approved

SHCV

-

No

No

Approved

Approved

3.2

Nickel barrier terminated multilayer CTVS

All EPCOS MLVs with nickel barrier termination are suitable and fully qualiyfied for lead-free sol-

dering. The nickel barrier layer is 100% matte tin-plated.

3.3

Silver-palladium terminated MLVs

AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-

al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb

solder.

Note:

Lead-free soldering is not approved for MLVs with AgPd termination.

3.4

Tinned copper alloy

All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.

3.5

Tinned iron wire

All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.

4

Solder joint profiles / solder quantity

4.1

Nickel barrier termination

If the meniscus height is too low, that means the solder quantity is too low, the solder joint may

break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-

ed as leaching of the external terminations.

SMD disk varistors (CU varistors)

Standard series

Page 21 of 33

Please read Cautions and warnings and

Important notes at the end of this document.