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PCA9622 Datasheet(PDF) 39 Page - NXP Semiconductors |
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PCA9622 Datasheet(HTML) 39 Page - NXP Semiconductors |
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39 / 39 page  NXP Semiconductors PCA9622 16-bit Fm+ I2C-bus 100 mA 40 V LED driver © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 August 2009 Document identifier: PCA9622_3 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 7 7.1 Device addresses . . . . . . . . . . . . . . . . . . . . . . . 7 7.1.1 Regular I2C-bus slave address . . . . . . . . . . . . . 7 7.1.2 LED All Call I2C-bus address . . . . . . . . . . . . . . 8 7.1.3 LED Sub Call I2C-bus addresses . . . . . . . . . . . 8 7.1.4 Software Reset I2C-bus address . . . . . . . . . . . 8 7.2 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3 Register definitions . . . . . . . . . . . . . . . . . . . . . 10 7.3.1 Mode register 1, MODE1 . . . . . . . . . . . . . . . . 11 7.3.2 Mode register 2, MODE2 . . . . . . . . . . . . . . . . 12 7.3.3 PWM0 to PWM15, individual brightness control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.3.4 GRPPWM, group duty cycle control . . . . . . . . 13 7.3.5 GRPFREQ, group frequency . . . . . . . . . . . . . 13 7.3.6 LEDOUT0 to LEDOUT3, LED driver output state . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3 . . . . . . . . . . . . . . . . . . . . . . 14 7.3.8 ALLCALLADR, LED All Call I2C-bus address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7.4 Active LOW output enable input . . . . . . . . . . . 15 7.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16 7.6 Software reset. . . . . . . . . . . . . . . . . . . . . . . . . 16 7.7 Individual brightness control with group dimming/blinking . . . . . . . . . . . . . . . . . . . . . . . 17 8 Characteristics of the I2C-bus. . . . . . . . . . . . . 18 8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.1.1 START and STOP conditions . . . . . . . . . . . . . 18 8.2 System configuration . . . . . . . . . . . . . . . . . . . 18 8.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 19 9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 20 10 Application design-in information . . . . . . . . . 22 10.1 Junction temperature calculation . . . . . . . . . . 23 10.1.1 Example 1: Tj calculation of PCA9622DR, in TSSOP32 package, when Tamb is known . . . . 24 10.1.2 Example 2: Tj calculation where only Tcase is known . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25 12 Thermal characteristics . . . . . . . . . . . . . . . . . 26 13 Static characteristics . . . . . . . . . . . . . . . . . . . 27 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 29 15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 31 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32 17 Handling information . . . . . . . . . . . . . . . . . . . 34 18 Soldering of SMD packages . . . . . . . . . . . . . . 34 18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 34 18.2 Wave and reflow soldering . . . . . . . . . . . . . . . 34 18.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 34 18.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 35 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 36 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 37 21 Legal information . . . . . . . . . . . . . . . . . . . . . . 38 21.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38 21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 21.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 38 21.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 38 22 Contact information . . . . . . . . . . . . . . . . . . . . 38 23 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 |
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