MCP1602 datasheet(5/26 Pages) MICROCHIP

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DS22061A-page 5

MCP1602

Output Voltage Tolerance Fixed

VOUT

-2.5

+2.5

Note 3

Line Regulation

VLINE-

REG

—0.3

—

%/V

VIN = VR + 1V to 5.5V,

IOUT =100 mA

Load Regulation

VLOAD-

REG

—0.4

—

VIN =VR +1.5V,

ILOAD = 100 mA to 500 mA, Note 1

Internal Oscillator Frequency

FOSC

1.6

2.0

2.4

MHz

Start Up Time

TSS

—0.5

—

TR = 10% to 90%

RDSon P-Channel

RDSon-P

—

450

—

IP =100 mA

RDSon N-Channel

RDSon-N

—

450

—

IN = 100 mA

LX Pin Leakage Current

ILX

-1.0

±0.01

1.0

µA

SHDN =0V, VIN = 5.5V, LX =0V,

LX =5.5V

Positive Current Limit Threshold +ILX(MAX)

—

700

—

Note 7

Power-Good (PG)

Voltage Range

VPG

1.0

1.2

—5.5

5.5

VTA = 0°C to +70°C

TA = -40°C to +85°C

VIN ≤ 2.7V, ISINK = 100 µA

PG Threshold High

VTH_H

—94

% of

VOUT

On Rising VOUT

PG Threshold Low

VTH_L

—

% of

VOUT

On Falling VOUT

PG Threshold Hysteresis

VTH_HYS

—2—

% of

VOUT

PG Threshold Tempco

ΔV

TH/ΔT—

—

ppm/°C

PG Delay

tRPD

—

165

—

µs

VOUT =(VTH_H + 100 mV) to

(VTH_L - 100 mV)

PG Active Time-out Period

tRPU

140

262

560

VOUT =(VTH_L -100 mV) to

(VTH_H +100 mV), ISINK =1.2mA

PG Output Voltage Low

PG_VOL

——

0.2

VVOUT =VTH_L -100 mV,

IPG = 1.2 mA, VIN >2.7V

IPG = 100 µA, 1.0 < VIN <2.7V

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, V

IN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,

VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40

oC to +85oC.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1: The minimum V

IN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

3: V

R is the output voltage setting.

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load

regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in

output voltage due to heating effects are covered by the thermal regulation specification.

5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum

allowable power dissipation causes the device to initiate thermal shutdown.

6: The internal MOSFET switches have an integral diode from the L

X pin to the VIN pin, and from the LX pin

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits

must be adhered too. Thermal protection is not able to limit the junction temperature for these cases.

7: The current limit threshold is a cycle-by-cycle current limit.

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