QX9775 datasheet(39/90 Pages) INTEL

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Datasheet

Mechanical Specifications

3.2

Processor Component Keepout Zones

The processor may contain components on the substrate that define component

keepout zone requirements. Decoupling capacitors are typically mounted to either the

topside or landside of the package substrate. See Figure 3-4 for keepout zones.

3.3

Package Loading Specifications

Table 3-1 provides dynamic and static load specifications for the processor package.

These mechanical load limits should not be exceeded during heatsink assembly,

mechanical stress testing or standard drop and shipping conditions. The heatsink

attach solutions must not include continuous stress onto the processor with the

exception of a uniform load to maintain the heatsink-to-processor thermal interface.

Also, any mechanical system or component testing should not exceed these limits. The

processor package substrate should not be used as a mechanical reference or load-

bearing surface for thermal or mechanical solutions.

NOTES:

These specifications apply to uniform compressive loading in a direction perpendicular to

the IHS top surface.

This is the minimum and maximum static force that can be applied by the heatsink and

retention solution to maintain the heatsink and processor interface.

These specifications are based on limited testing for design characterization. Loading limits

are for the LGA771 socket.

Dynamic compressive load applies to all board thickness.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static

load requirement.

Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink

mass. The dynamic portion of this specification in the product application can have

flexibility in specific values, but the ultimate product of mass times acceleration should not

exceed this dynamic load.

Transient bend is defined as the transient board deflection during manufacturing such as

board assembly and system integration. It is a relatively slow bending event compared to

shock and vibration tests.

Refer to the for information on heatsink clip load metrology.

Table 3-1.

Package Loading Specifications

Parameter

Board

Thickness

Min

Max

Unit

Notes

Static

Compressive Load

1.57 mm

0.062”

311

lbf

1,2,3,8

2.16 mm

0.085”

111

311

lbf

2.54 mm

0.100”

133

311

lbf

Dynamic

Compressive Load

311 N (max static

compressive load) +

222 N dynamic loading

70 lbf (max static

compressive load) +

50 lbf dynamic loading

lbf

1,3,4,5,6

Transient Bend

Limits

1.57 mm

0.062”

750

1,3,7

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