SPI Driver for Enhanced Relay Control

SPIDER - TLE7243SL

General Product Characteristics

Datasheet

10

Rev. 1.0, 2009-09-30

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

4.2

Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards.

For more information, go to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

Digital supply voltage

V

DD

3.0

5.5

V

–

4.2.1

Analog supply voltage

V

DDA

4.5

5.5

V

–

4.2.2

extended supply range

V

DDA

4.0

4.5

parameter

deviations are

possible

4.2.3

Digital Supply current in reset mode

I

DD(RST)

–10

µA

4.2.4

Digital supply current

(all channels active)

I

DD(ON)

–0.5

mA

V

V

DD

4.2.5

Analog supply current

(all channels active)

I

DDA(ON)

–5mA

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.6

Junction to Soldering Point

R

thJSP

––

25

K/W

1) 2)

1) Not subject to production test, specified by design

2) Specified

R

T

4.3.7

Junction to Ambient

R

thJA

–68

–

K/W

1) 3)

3) Specified

R

and 70

4.3.8

Junction to Ambient (2s2p)

R

thJA

–60

–

K/W

1) 4)

4) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70

μm Cu, 2 x 35 μm Cu).

T