DS1318_10 datasheet(2/15 Pages) MAXIM

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Parallel-Interface Elapsed Time Counter

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ABSOLUTE MAXIMUM RATINGS

RECOMMENDED DC OPERATING CONDITIONS

(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on any Pin Relative to Ground ......-0.3V to +6.0V

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-55°C to +125°C

Lead Temperature (soldering, 10s) .................................+260°C

Soldering Temperature (reflow) .......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TSSOP (multilayer board)

Junction-to-Ambient Thermal Resistance (

θJA) ............72°C/W

Junction-to-Case Thermal Resistance (

θJC) .................13°C/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

(Note 3)

3.0

3.3

3.6

Battery Voltage

VBAT

(Note 3)

1.6

3.3

3.7

Logic 1 Voltage

VIH

(Note 3)

0.7 x

VCC

VCC +

0.5

Logic 0 Voltage

VIL

(Note 3)

-0.5

+0.3 x

VCC

DC ELECTRICAL CHARACTERISTICS

(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Logic 0 Output Current

(VOL = 0.15 x VCC)

IOL

Logic 1 Output Current

(VOH = 0.85 x VCC)

IOH

SQW, INT Logic 0 Output

(VOL = 0.15 x VCC)

IOLSI

Input Leakage

ILI

(Note 4)

μA

I/O Leakage

ILO

(Note 5)

-1

μA

Active Supply Current

ICCA

(Note 6)

Standby Current

ICCS

(Note 7)

100

150

μA

Battery Input-Leakage Current

IBATLKG

100

Power-Fail Voltage

VPF

(Note 3)

2.70

2.97

Note 1:

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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