iC-TL33 TO46-2L1

Infrared LED

Rev B1, Page 3/4

DIAGRAMS

AMBIENT TEMPERATURE [°C]

THERMAL DERATING CURVE

125

100

150

100

50

75

50

25

0

Figure 1: Maximum power dissipation with respect

to temperature

0

1

2

-1

-2

-3

Distance LED to sensor:

10 mm

3 mm

1 mm

iC-TL33 illumination pattern

Sensor position [mm]

3

Figure 2: Illumination pattern depending vs.

dis-

tance

Degradation of optical output power at 125°C

-40%

-30%

-20%

-10%

0%

0

500

1000

1500

2000

Burn-In Time [h]

125°C, 20 mA forward current (mean of 32 devices)

125°C, 50 mA forward current (mean of 32 devices)

Figure 3: Optical output as a function of time. Mean

value shown of 32 devices each.

LED’s generally display a degradation in their optical

power depending on the profile of the individual appli-

cation, i.e. the forward current, chip temperature and

operating time. Typical behavior is shown in Figure 3,

from which the service life can be inferred. Depending

on the profile of use the light yield can be reduced by

30% to 50% during deployment in an industrial applica-

tion (e.g. 50,000 hours), making an LED power control

necessary. The design and dimensioning of the LED

circuitry is determined by the qualification according to

the application-specific profile of use.

State-of-the-art technology guarantees a minimum

beam power in an as-received condition with a defined

current (25°C). A run-in at an operating point of 20 mA

and a chip temperature of 125°C for 72 hours enables

statements to be made as to the initial degradation dur-

ing an accelerated stress test; it does not, however,

provide any conclusions as to the service life of the

LED.

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