BZT52C2V4LP - BZT52C39LP

SURFACE MOUNT ZENER DIODE

Features

•

Ultra-Small Leadless Surface Mount Package

•

Ideally Suited for Automated Assembly Processes

•

Lead Free By Design/RoHS Compliant (Note 1)

•

"Green" Device (Note 2)

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

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Case: DFN1006-2

•

Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminal Connections: Cathode Dot (See Marking Information)

•

Terminals: Finish

⎯ NiPdAu Over Copper Leadframe.

Solderable per MIL-STD-202, Method 208

•

Marking Information: See Page 3

•

Ordering Information: See Page 3

•

Weight: 0.001 grams

Bottom View

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 4)

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

250

mW

Thermal Resistance, Junction to Ambient Air

500

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3. Device mounted on FR-4 PCB with minimum recommended pad layout pattern as shown on page 4.

4. Short duration pulse test used to minimize self-heating effect.

BZT52C2V4LP - BZT52C39LP

Document number: DS30506 Rev. 17 - 2

1 of 4

www.diodes.com

August 2008

© Diodes Incorporated

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