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MPC5606S Datasheet(PDF) 80 Page - Freescale Semiconductor, Inc |
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MPC5606S Datasheet(HTML) 80 Page - Freescale Semiconductor, Inc |
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80 / 136 page ![]() MPC5606S Microcontroller Data Sheet, Rev. 6 Freescale Semiconductor 80 3.8.4 I/O pad current specification The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a VDD/VSS supply pair as described in Table 36. Table 37 provides I/O consumption figures. In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG maximum value. In order to ensure device functionality, the sum of the dynamic and static current of the I/O on a single segment should remain below the IDYNSEG maximum value. IPU CC P Internal pull-up device current Vin=VIL –130 — — A Vin=VIH — — –10 IPD CC P Internal pull-down device current Vin=VIL 10 — — Vin=VIH — — 130 IIN CC P Input leakage current — -1 — 1 RDSONH CC C SMD pad driver active high impedance IOH –30 mA2 —— 16 RDSONL CC C SMD pad driver active low impedance IOL 30 mA2 —— 16 VOMATCH CC P Output driver matching VOH /VOL IOH /IOL 30 mA 2 —— 90 mV 1 VDD = 5.0 V ±10%, Tj = -40 to 150 °C. 2 VDD = 5.0 V ±10%, Tj = -40 to 130 °C. Table 36. I/O supply segment Package Supply segment A1 1 LCD pad segment containing pad supplies V DDE_A B2 2 Miscellaneous pad segment containing pad supplies V DDE_B C3,4 3 ADC pad segment containing pad supplies V DDE_C 4 V DDE_C should be the same as VDDA with a 100 mV variation, i.e., VDDE_C = VDDA 100 mV. D5 5 Stepper Motor pad segment containing I/O supplies V DDMA, VDDMB, VDDMC E6 6 Miscellaneous pad segment containing pad supplies V DDE_E 144 LQFP pins 1–21 pins 113–144 pins 22– 52 pins 53–72 pins 73–102 pins 103–112 176 LQFP pins 1–21 pins 143–176 pins 22–68 pins 69–88 pins 89–118 pins 119–142 Table 35. SMD pad electrical characteristics (continued) Symbol C Parameter Conditions Value Unit Min Typ Max |
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