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ZXMD63N02X Datasheet(PDF) 4 Page - Diodes Incorporated

Part # ZXMD63N02X
Description  DUAL 20V N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  7 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXMD63N02X Datasheet(HTML) 4 Page - Diodes Incorporated

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ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN.
TYP.
MAX.
UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
V(BR)DSS
20
V
ID=250µA, VGS=0V
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS=20V, VGS=0V
Gate-Body Leakage
IGSS
100
nA
VGS=± 12V, VDS=0V
Gate-Source Threshold Voltage
VGS(th)
0.7
V
ID=250µA, VDS= VGS
Static Drain-Source On-State Resistance
(1)
RDS(on)
0.130
0.150
Ω
Ω
VGS=4.5V, ID=1.7A
VGS=2.7V, ID=0.85A
Forward Transconductance (3)
gfs
2.6
S
VDS=10V,ID=0.85A
DYNAMIC (3)
Input Capacitance
Ciss
350
pF
VDS=15 V, VGS=0V,
f=1MHz
Output Capacitance
Coss
120
pF
Reverse Transfer Capacitance
Crss
50
pF
SWITCHING(2) (3)
Turn-On Delay Time
td(on)
3.4
ns
VDD =10V, ID=1.7A
RG=6.0Ω, RD=5.7Ω
(Refer to test
circuit)
Rise Time
tr
8.1
ns
Turn-Off Delay Time
td(off)
13.5
ns
Fall Time
tf
9.1
ns
Total Gate Charge
Qg
6nC
VDS=16V,VGS=4.5V,
ID=1.7A
(Refer to test
circuit)
Gate-Source Charge
Qgs
0.65
nC
Gate Drain Charge
Qgd
2.5
nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
VSD
0.95
V
Tj=25°C, IS=1.7A,
VGS=0V
Reverse Recovery Time (3)
trr
15.0
ns
Tj=25°C, IF=1.7A,
di/dt= 100A/
µs
Reverse Recovery Charge(3)
Qrr
5.9
nC
(1) Measured under pulsed conditions. Width=300
µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ZXMD63N02X
4
ISSUE
1 - JUNE 2004



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