ZXMN2A04DN8

ISSUE 1 - JULY 2004

SEMICO NDUC TORS

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a) (d)

100

°C/W

Junction to Ambient

(b) (e)

70

°C/W

Junction to Ambient

(b) (d)

60

°C/W

THERMAL RESISTANCE

NOTES:

(a) For a dual device surface mounted on 25mm x 25mm FR4 PCB with coverage of single sided 1oz copper in still air conditions.

(b) For a dual device surface mounted on FR4 PCB measured at t

10 sec.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs - pulse width limited by maximum junction temperature. Refer to Trnsient

Thermal Impedance Graph.

(d) For a dual device with one active die.

(e) For dual device with 2 active die running at equal power.

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

20

V

Gate Source Voltage

12

V

Continuous Drain Current

(b) (d)

(b) (d)

(a) (d)

7.7

6.2

5.9

A

A

A

Pulsed Drain Current

(c)

38

A

Continuous Source Current (Body Diode)

(b)

2.9

A

Pulsed Source Current (Body Diode)

(c)

38

A

(a) (d)

Linear Derating Factor

1.25

10

W

mW/°C

(a) (e)

Linear Derating Factor

1.8

14

W

mW/°C

(b) (d)

Linear Derating Factor

2.1

17

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS