Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

K30P100M100SF2 Datasheet(PDF) 2 Page - Freescale Semiconductor, Inc

Part # K30P100M100SF2
Description  Up to 100 MHz ARM Cortex-M4 core with DSP structions delivering 1.25 Dhrystone MIPS per MHz
PDF  61 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

K30P100M100SF2 Datasheet(HTML) 2 Page - Freescale Semiconductor, Inc

  K30P100M100SF2 Datasheet HTML 1Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 2Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 3Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 4Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 5Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 6Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 7Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 8Page - Freescale Semiconductor, Inc K30P100M100SF2 Datasheet HTML 9Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 61 page
background image
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................10
5.1 Nonswitching electrical specifications...............................10
5.1.1
Voltage and current operating requirements.........10
5.1.2
LVD and POR operating requirements.................11
5.1.3
Voltage and current operating behaviors..............11
5.1.4
Power mode transition operating behaviors..........12
5.1.5
Power consumption operating behaviors..............13
5.1.6
EMC radiated emissions operating behaviors.......16
5.1.7
Designing with radiated emissions in mind...........17
5.1.8
Capacitance attributes..........................................17
5.2 Switching specifications.....................................................17
5.2.1
Device clock specifications...................................17
5.2.2
General switching specifications...........................17
5.3 Thermal specifications.......................................................18
5.3.1
Thermal operating requirements...........................18
5.3.2
Thermal attributes.................................................18
6 Peripheral operating requirements and behaviors....................19
6.1 Core modules....................................................................19
6.1.1
Debug trace timing specifications.........................19
6.1.2
JTAG electricals....................................................20
6.2 System modules................................................................23
6.3 Clock modules...................................................................23
6.3.1
MCG specifications...............................................23
6.3.2
Oscillator electrical specifications.........................26
6.3.3
32kHz Oscillator Electrical Characteristics............28
6.4 Memories and memory interfaces.....................................28
6.4.1
Flash (FTFL) electrical specifications....................29
6.4.2
EzPort Switching Specifications............................30
6.5 Security and integrity modules..........................................31
6.6 Analog...............................................................................31
6.6.1
ADC electrical specifications.................................31
6.6.2
CMP and 6-bit DAC electrical specifications.........38
6.6.3
12-bit DAC electrical characteristics.....................41
6.6.4
Voltage reference electrical specifications............44
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................45
6.8.1
CAN switching specifications................................46
6.8.2
DSPI switching specifications (low-speed mode)..46
6.8.3
DSPI switching specifications (high-speed mode) 47
6.8.4
I2C switching specifications..................................49
6.8.5
UART switching specifications..............................49
6.8.6
SDHC specifications.............................................49
6.8.7
I2S switching specifications..................................50
6.9 Human-machine interfaces (HMI)......................................52
6.9.1
TSI electrical specifications...................................52
6.9.2
LCD electrical characteristics................................53
7 Dimensions...............................................................................54
7.1 Obtaining package dimensions.........................................54
8 Pinout........................................................................................54
8.1 K30 Signal Multiplexing and Pin Assignments..................54
8.2 K30 Pinouts.......................................................................58
9 Revision History........................................................................60
K30 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com