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MCP6V27 Datasheet(PDF) 21 Page - Microchip Technology |
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MCP6V27 Datasheet(HTML) 21 Page - Microchip Technology |
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21 / 46 page ![]() © 2011 Microchip Technology Inc. DS25007A-page 21 MCP6V27 4.2 Other Functional Blocks 4.2.1 RAIL-TO-RAIL INPUTS The input stage of the MCP6V27 op amp uses two differential CMOS input stages in parallel. One operates at low common mode input voltage (VCM, which is approximately equal to VIN+ and VIN– in normal operation) and the other at high VCM. With this topology, the input operates with VCM up to VDD +0.2V, and down to VSS – 0.15V, at +25°C (see Figure 2-18). The input offset voltage (VOS) is measured at VCM =VSS – 0.15V and VDD + 0.2V to ensure proper operation. The transition between the input stages occurs when VCM ≈ VDD –1.2V (see Figure 2-7 and Figure 2-8). For the best distortion and gain linearity, with non-inverting gains, avoid this region of operation. 4.2.1.1 Phase Reversal The input devices are designed to not exhibit phase inversion when the input pins exceed the supply voltages. Figure 2-43 shows an input voltage exceeding both supplies with no phase inversion. 4.2.1.2 Input Voltage Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the voltages at the input pins (see Section 1.1, Absolute Maximum Ratings †). This requirement is independent of the cur- rent limits discussed later on. The ESD protection on the inputs can be depicted as shown in Figure 4-4. This structure was chosen to protect the input transistors against many (but not all) over-voltage conditions, and to minimize input bias cur- rent (IB). FIGURE 4-4: Simplified Analog Input ESD Structures. The input ESD diodes clamp the inputs when they try to go more than one diode drop below VSS. They also clamp any voltages that are well above VDD; their breakdown voltage is high enough to allow normal operation, but not low enough to protect against slow over-voltage (beyond VDD) events. Very fast ESD events (that meet the spec) are limited so that damage does not occur. In some applications, it may be necessary to prevent excessive voltages from reaching the op amp inputs; Figure 4-5 shows one approach to protecting these inputs. D1 and D2 may be small signal silicon diodes, Schottky diodes for lower clamping voltages or diode- connected FETs for low leakage. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. 4.2.1.3 Input Current Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the currents into the input pins (see Section 1.1, Absolute Maxi- mum Ratings †). This requirement is independent of the voltage limits previously discussed. Figure 4-6 shows one approach to protecting these inputs. The resistors R1 and R2 limit the possible cur- rent in or out of the input pins (and into D1 and D2). The diode currents will dump onto VDD. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. Bond Pad Bond Pad Bond Pad VDD VIN+ VSS Input Stage Bond Pad VIN– V1 VDD D1 VOUT V2 D2 U1 ½MCP6V27 V1 R1 VDD D1 min(R1,R2)> VSS –min(V1,V2) 2mA VOUT V2 R2 D2 min(R1,R2)> max(V1,V2)– VDD 2mA U1 ½ MCP6V27 |
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