MPC5675K datasheet(1/140 Pages) FREESCALE

Part #	MPC5675K

Description	Microcontroller is a 32-bit embedded controller designed for advanced

PDF	140 Pages

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MPC5675K

Rev. 4, 04/2011

Preliminary—Subject to Change Without Notice

This document contains information on a product under development. Freescale reserves the

right to change or discontinue this product without notice.

MPC5675K

TBD

MAPBGA–225

15 mm x 15 mm

QFN12

##_mm_x_##mm

SOT-343R

##_mm_x_##mm

PKG-TBD

## mm x ## mm

257 MAPBGA

(14 x 14 mm)

473 MAPBGA

(19 x 19 mm)

1

Overview

This document provides electrical specifications,

pin assignments, and package diagrams for the

MPC5675K series of microcontroller units

(MCUs).

The MPC5675K microcontroller is a 32-bit

embedded controller designed for advanced driver

assistance systems with RADAR, CMOS imaging,

LIDAR and ultrasonic sensors, and multiple

3-phase motor control applications as in hybrid

electric vehicles (HEV) in automotive and high

temperature industrial applications.

A member of Freescale Semiconductor’s

MPC5500/5600 family, it contains the Book E

compliant Power Architecture

 technology core

with Variable Length Encoding (VLE). This core

complies with the Power Architecture embedded

category, and is 100 percent user mode compatible

with the original Power PC

 user instruction set

architecture (UISA). It offers system performance

up to four times that of its MPC5561 predecessor,

while bringing you the reliability and familiarity of

the proven Power Architecture technology.

A comprehensive suite of hardware and software

development tools is available to help simplify and

speed system design. Development support is

available from leading tools vendors providing

compilers, debuggers and simulation development

environments.

MPC5675K Microcontroller

Data Sheet

1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2

Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.3

Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.4

Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2

Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 23

2.1

Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2.2

Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3

Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

3.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

3.2

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 73

3.3

Recommended operating conditions . . . . . . . . . . . . . . 75

3.4

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 77

3.5

Electromagnetic interference (EMI) characteristics . . . 79

3.6

Electrostatic discharge (ESD) characteristics. . . . . . . . 79

3.7

Static latch-up (LU). . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

3.8

Power Management Controller (PMC) electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

3.9

Supply current characteristics . . . . . . . . . . . . . . . . . . . 82

3.10 Temperature sensor electrical characteristics . . . . . . . 83

3.11 Main oscillator electrical characteristics . . . . . . . . . . . . 83

3.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 84

3.13 16 MHz RC oscillator electrical characteristics . . . . . . 85

3.14 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 85

3.15 Flash memory electrical characteristics . . . . . . . . . . . . 91

3.16 SRAM memory electrical characteristics . . . . . . . . . . . 93

3.17 GP pads specifications . . . . . . . . . . . . . . . . . . . . . . . . . 93

3.18 PDI pads specifications . . . . . . . . . . . . . . . . . . . . . . . . 95

3.19 DRAM pad specifications . . . . . . . . . . . . . . . . . . . . . . 100

3.20 RESET characteristics . . . . . . . . . . . . . . . . . . . . . . . . 106

3.21 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

3.22 Peripheral timing characteristics. . . . . . . . . . . . . . . . . 114

4

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

4.1

Package mechanical data. . . . . . . . . . . . . . . . . . . . . . 136

5

Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

6

Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

7

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 143

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