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APT24F50B Datasheet(PDF) 4 Page - Microsemi Corporation |
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APT24F50B Datasheet(HTML) 4 Page - Microsemi Corporation |
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4 / 4 page ![]() D 3PAK Package Outline TO-247 (B) Package Outline e3 100% Sn Plated 15.49 (.610) 16.26 (.640) 5.38 (.212) 6.20 (.244) 6.15 (.242) BSC 4.50 (.177) Max. 19.81 (.780) 20.32 (.800) 20.80 (.819) 21.46 (.845) 1.65 (.065) 2.13 (.084) 1.01 (.040) 1.40 (.055) 3.50 (.138) 3.81 (.150) 2.87 (.113) 3.12 (.123) 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 2.21 (.087) 2.59 (.102) 0.40 (.016) 0.79 (.031) Drain Source Gate 5.45 (.215) BSC Dimensions in Millimeters and (Inches) 2-Plcs. 15.95 (.628) 16.05(.632) 1.22 (.048) 1.32 (.052) 5.45 (.215) BSC {2 Plcs.} 4.98 (.196) 5.08 (.200) 1.47 (.058) 1.57 (.062) 2.67 (.105) 2.84 (.112) 0.46 (.018) {3 Plcs} 0.56 (.022) Dimensions in Millimeters (Inches) Heat Sink (Drain) and Leads are Plated 3.81 (.150) 4.06 (.160) (Base of Lead) 1.98 (.078) 2.08 (.082) Gate Drain Source 0.020 (.001) 0.178 (.007) 1.27 (.050) 1.40 (.055) 11.51 (.453) 11.61 (.457) 13.41 (.528) 13.51(.532) Revised 8/29/97 1.04 (.041) 1.15(.045) 13.79 (.543) 13.99(.551) Revised 4/18/95 Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. US and Foreign patents pending. All Rights Reserved. 0.1 1 10 100 1 10 100 800 0.1 1 10 100 1 10 100 800 1ms 100ms Rds(on) Scaling for Different Case & Junction Temperatures: I D = I D(T C = 25 °C)*(TJ - TC)/125 DC line 100µs I DM 10ms 13µs 100µs I DM 100ms 10ms 13µs Rds(on) DC line T J = 150°C T C = 25°C 1ms Peak TJ = PDM x ZθJC + TC Duty Factor D = t1/t 2 t2 t1 Note: t1 = Pulse Duration 0.5 SINGLE PULSE 0.1 0.3 0.7 0.05 D = 0.9 T J = 125°C T C = 75°C V DS , DRAIN-TO-SOURCE VOLTAGE (V) V DS , DRAIN-TO-SOURCE VOLTAGE (V) Figure 9, Forward Safe Operating Area Figure 10, Maximum Forward Safe Operating Area 10-5 10-4 10-3 10-2 10-1 1.0 RECTANGULAR PULSE DURATION (seconds) Figure 11. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 APT24F50B_S |
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