Absolute Maximum Ratings

Thermal and Mechanical Characteristics

G

D

S

Single die FREDFET

Unit

A

V

mJ

A

Unit

W

°C/W

°C

oz

g

in·lbf

N·m

Ratings

37

24

115

±30

780

18

Min

Typ

Max

520

0.24

0.11

-55

150

300

0.22

6.2

10

1.1

Parameter

Continuous Drain Current @ T

Continuous Drain Current @ T

Gate-Source Voltage

Avalanche Current, Repetitive or Non-Repetitive

Characteristic

Total Power Dissipation @ T

Junction to Case Thermal Resistance

Case to Sink Thermal Resistance, Flat, Greased Surface

Operating and Storage Junction Temperature Range

Soldering Temperature for 10 Seconds (1.6mm from case)

Package Weight

Mounting Torque ( TO-247 Package), 6-32 or M3 screw

Symbol

I

D

I

DM

V

GS

E

AS

I

AR

Symbol

P

D

R

θJC

R

θCS

T

T

L

W

T

Torque

TYPICAL APPLICATIONS

• ZVSphaseshiftedandotherfullbridge

•Halfbridge

•PFCandotherboostconverter

• Buckconverter

•Singleandtwoswitchforward

•Flyback

FEATURES

•FastswitchingwithlowEMI

•Lowtrrforhighreliability

•UltralowCrssforimprovednoiseimmunity

•Lowgatecharge

•Avalancheenergyrated

•RoHScompliant

TO-247

APT37F50B

APT37F50S

500V,37A,0.15

ΩMax,trr,≤250ns

APT37F50B

APT37F50S

This 'FREDFET' version has a drain-source (body) diode that has been optimized for

recovery, and high recovery dv/dt capability. Low gate charge, high gain, and a greatly

intrinsic gate resistance and capacitance of the poly-silicon gate structure help control

di/dt during switching, resulting in low EMI and reliable paralleling, even when switching

at very high frequency.

N-ChannelFREDFET

MicrosemiWebsite-http://www.microsemi.com