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MB86K23 Datasheet(PDF) 2 Page - fujitsu semiconductor

Part # MB86K23
Description  The Fujitsu IEEE 802.16e-2005 Mobile WiMAX SoC
PDF  2 Pages
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Manufacturer  FUJITSU [fujitsu semiconductor]
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Logo FUJITSU - fujitsu semiconductor

MB86K23 Datasheet(HTML) 2 Page - fujitsu semiconductor

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FUJITSU MICROELECTRONICS AMERICA, INC.
Corporate Headquarters
1250 E. Arques Avenue, M/S 333, Sunnyvale, CA 94085-5401
Tel: (800) 866-8608 Fax: (408) 737-5999
E-mail: inquiry@fma.fujitsu.com Web Site: http://us.fujitsu.com/micro
© 2009 Fujitsu Microelectronics America, Inc.
All company and product names are trademarks or
registered trademarks of their respective owners.
Printed in the U.S.A. EPS-FS-21349-02/2009
• Features compliant with IEEE 802.16e-2005 Mobile
WiMAX (Mobile station)
–
OFDMA PHY with TDD
–
512/1024/2048 points FFT
–
Supports channel bandwidths
3.5MHz/7MHz/10MHz/20MHz
–
64 QAM (DL), 16 QAM, QPSK adaptive
modulation
–
Optional space time coding with 2-antenna
matrix A/B
–
HARQ chase combining with CTC
• A/D converter and D/A converter for the baseband
analog IQ interface
• RF control function
–
Programmable AGC control for supporting
broad range of RF LSI and alternative RF
front-ends
–
RF control Logic programs the Rx and Tx gain
when the radio switches between receive and
transmit
• Multi-function peripheral interface
–I2C
–
UART
–
SDIO
–
SPI
–
USB 2.0
–
SPI flash
–
SDR SDRAM
• Internal power control function
–
Built-in power management unit (PMU)
supporting idle mode and sleep mode
–
Smart power management unit works with
external power management IC to efficiently
manage power utilization
–
CoolAdjust Power Gating technique to turn off
unused portions of baseband and other external
components to substantially reduce overall
power consumption
• 65nm low-leak technology
• Package size: 10mm x 10mm
Features
MB86K23
MB86K23 WiMAX Chip: 10mm x 10mm



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