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PCF8523 Datasheet(PDF) 57 Page - NXP Semiconductors |
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PCF8523 Datasheet(HTML) 57 Page - NXP Semiconductors |
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57 / 66 page  PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 30 March 2011 57 of 66 NXP Semiconductors PCF8523 Real-Time Clock (RTC) and calendar 17. Packing information (1) Die marking code. Seal ring plus gap to active circuit ~18 m. Wafer thickness 200 m. PCF8523U: bad die are marked in wafer mapping. Fig 41. PCF8523U wafer information 013aaa232 Saw lane ~18 μm 45 μm 70 μm ~18 μm detail X 1.449 mm 1.492 mm 1 1 1 1 X straight edge of the wafer (1) Fig 42. Film Frame Carrier (FFC) (for PCF8523U) 013aaa351 2.6 mm 60.2 mm 63.5 mm ∅ 250 mm 276 mm 276 mm 0.3 plastic frame plastic film straight edge of the wafer |
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