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2DC4617QLP Datasheet(PDF) 2 Page - Diodes Incorporated

Part # 2DC4617QLP
Description  50V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
PDF  5 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

2DC4617QLP Datasheet(HTML) 2 Page - Diodes Incorporated

  2DC4617QLP Datasheet HTML 1Page - Diodes Incorporated 2DC4617QLP Datasheet HTML 2Page - Diodes Incorporated 2DC4617QLP Datasheet HTML 3Page - Diodes Incorporated 2DC4617QLP Datasheet HTML 4Page - Diodes Incorporated 2DC4617QLP Datasheet HTML 5Page - Diodes Incorporated  
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2DC4617QLP
Document number: DS31439 Rev. 4 - 2
2 of 5
www.diodes.com
February 2011
© Diodes Incorporated
2DC4617QLP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
V
Collector-Emitter Voltage
VCEO
50
V
Emitter-Base Voltage
VEBO
5.0
V
Collector Current - Continuous
IC
100
mA
Peak Collector Current
ICM
200
mA
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 4)
PD
250
mW
Thermal Resistance, Junction to Ambient (Note 4)
RθJA
500
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage
V(BR)CBO
50
⎯
V
IC = 50μA, IE = 0
Collector-Emitter Breakdown Voltage
V(BR)CEO
50
⎯
V
IC = 1.0mA, IB = 0
Emitter-Base Breakdown Voltage
V(BR)EBO
5.0
⎯
V
IE = 50μA, IC = 0
Collector Cutoff Current
ICBO
⎯
100
5
nA
μA
VCB = 30V
VCB = 30V, TA = 150°C
Emitter Cutoff Current
IEBO
⎯
100
nA
VEB = 4.0V
ON CHARACTERISTICS (Note 5)
DC Current Gain
hFE
120
270
⎯
VCE = 6.0V, IC = 1.0mA
Collector-Emitter Saturation Voltage
VCE(SAT)
⎯
0.2
V
IC = 50mA, IB = 5.0mA
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Cobo
⎯
3.5
pF
VCB = 12V, f = 1.0MHz, IE = 0
Current Gain-Bandwidth Product
fT
100
⎯
MHz
VCE = 12V, IC = 2.0mA,
f = 100MHz
Notes:
4. Part mounted on FR-4 PCB with recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.



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