DIMENSION

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.130

.146

3.30

3.70

B

.008

.016

0.20

0.40

C

.055

.059

1.40

1.50

Features

l High-Speed Switching and High Reverse Breakdown Voltage

l Moisture Sensitivity Level 1

Mechanical Data

l Case: MiniMELF, Glass

l Terminals: Solderable per MIL-STD-202, Method 208

l Polarity: Indicated by Cathode Band

Characteristic

Symbol

Min

Max

Unit

Peak Repetitive Reverse Voltage

75

V

Continuous reverse Voltage

75

V

Continuous forward current

200

mA

Repetitive peak Forward Current

450

mA

Non-rep. Peak Forward Current

t=1 us

t=1 ms

t= 1 s

4

1

0.5

A

Power Dissipation

500

mW

Thermal Resistance(Note 2)

R

350

K/W

Operation/Storage Temp. Range

-65

200

o

C

Charateristic

Symbol Min

Max

Unit

Test Cond.

Reverse Breakdown Volt.

100

-----

V

Reverse Current

-----

25

5

50

100

nA

uA

uA

uA

o

C

o

C

Forward Voltage

620

---

---

750

1000

930

mV

mV

mV

o

C

Junction Capacitance

Cj

-----

2.0

pF

Reverse Recovery Time

-----

4

ns

2. Valid provided that electrodes are kept at ambient temperature

BAS32L

High Speed

Switching Diode

MINIMELF

SUGGESTED SOLDER

PAD LAYOUT

A

B

C

Cathode Band

.165

.075

.030

omponents

20736 Marilla

Street Chatsworth



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MCC

Revision: A

2011/01/01

TM

Micro Commercial Components

1 of 4

l Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

Note:

1.

Lead in Glass Exemption Applied, see EU Directive Annex 5.

3. Device mounted on an FR4 printed-circuit board.