preliminary

preliminary

iC-DC

2-CHANNEL BUCK/BOOST DC/DC CONVERTER

Rev A3, Page 4/19

PACKAGES

PIN CONFIGURATION

QFN24-4x4 (4 mm x 4 mm)

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DC

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

PIN FUNCTIONS

No. Name

Function

1 RREF

Reference Resistor

2 GNDA

Analog Ground

3 CFG1

VCC1 Configuration 3.3/5.0 V or

1.5 V to 5.5 V with ext. R Divider

4 CFG2

VCC2 Configuration2.5/3.3 V or

1.5 V to 5.5 V with ext. R Divider

5 TEST

Test Input

6 POE2

Power Output Enable VCC2 Voltage

7 V2OK

Error Output VCC2 Voltage

8 VCC2

1.5 V to 5.5 V Lin. Regulator Output 2

9 VH2

Intermediate Voltage 2

for VCC2 Regulator

10 VH1

Intermediate Voltage 1

for VCC1 Regulator

11 VCC1

1.5 V to 5.5 V Lin. Regulator Output 1

12 V1OK

Error Output VCC1 Voltage

13 POE1

Power Output Enable VCC1 Voltage

14 VH

Intermediate Voltage

15 VHL

Inductor Terminal VH

16 GND

Power Ground

17 VBL

Inductor Terminal VB

18 VBR

Reverse Protected Supply Voltage

19 VB

+4 V to +36 V Supply Voltage

20 ENV1

VCC1 Linear Regulator Activation

21 ENV2

VCC2 Linear Regulator Activation

22 VBROK Error Output Supply Voltage

23 TOK

Error Output Overtemperature

24 NAUT

Error Output Autarky

TP

Thermal Pad

The Thermal Pad on the underside of the package should be appropriately connected to GND for better heat

dissipation (ground plane). GNDA should also be directly connected to neutral point GND. Ground loops should

be avoided.

Only the Pin 1 mark on the front or reverse is determinative for package orientation (

DC and code are

subject to change).