SMBJ3V3 datasheet(2/4 Pages) VISHAY

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Revision: 20-Apr-11

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SMBJ3V3

Vishay General Semiconductor

New Product

Note

(1) Thermal resistance from junction to lead - mounted on 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pads to each terminal

(2) Thermal resistance from junction to ambient - mounted on the recommended PCB pad layout

RATINGS AND CHARACTERISTICS CURVES

(TA = 25 °C unless otherwise noted)

Fig. 1 - Pulse Waveform

Fig. 2 - Peak Pulse Power Rating Curve

Fig. 3 - Relative Variation of Leakage Current vs.

Junction Temperature

Fig. 4 - Clamping Voltage vs. Peak Pulse Current

(TJ initial = 25 °C)

THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

SYMBOL

VALUE

UNIT

Typical thermal resistance, junction to lead

RJL (1)

°C/W

Typical thermal resistance, junction to ambient

RJA (2)

100

°C/W

ORDERING INFORMATION (Example)

PREFERRED P/N

UNIT WEIGHT (g)

PREFERRED PACKAGE CODE

BASE QUANTITY

DELIVERY MODE

SMBJ3V3-M3/52

0.096

750

7" diameter plastic tape and reel

SMBJ3V3-M3/5B

0.096

3200

13" diameter plastic tape and reel

100

150

1.0

2.0

3.0

4.0

r = 8 µs

r = 10 µs

t - Time (ms)

d = 1000 µs

d = 20 µs

Peak Value

PPM

Half Value -

PPM

J = 25 °C

Pulse Width (t

is defined as the Point

where the Peak Current

decays to 50 % of I

PPM

0.1

0.01

0.1

td - Pulse Width (ms)

0.1

100

125

150

175

TJ - Junction T emperature (°C)

0.1

100

1000

IPP (A)

10/1000 µs

8/20 µs

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