LXXLD70G-SH2-R datasheet(4/8 Pages) UTC

4 / 8 page

LXXLD70

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

4 of 8

www.unisonic.com.tw

QW-R502-674.a

ABSOLUTE MAXIMUM RATING

PARAMETER

SYMBOL

RATINGS

UNIT

Supply Voltage (VCNTL to GND)

VCNTL

-0.3 ~ +7

Supply Voltage (VIN to GND)

VIN

-0.3 ~ +3.9

EN and FB to GND

VI/O

-0.3 ~ VCNTL+0.3

POK to GND Voltage

VPOK

-0.3 ~ +7

Power Dissipation

Lead Soldering Temperature, 10 Seconds

TSDR

260

°С

Junction Temperature

150

°С

Storage Temperature

TSTG

-65 ~ +150

°С

Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.

THERMAL DATA

PARAMETER

SYMBOL

RATINGS

UNIT

Junction to Ambient in Free Air (Note 1)

θJA

°C/W

Junction to Case (Note 2)

θJC

°C/W

Notes: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

The exposed pad of HSOP-8 is soldered directly on the PCB.

2. The Thermal Pad Temperature is measured on the PCB copper area connected to the thermal pad of

package.

RECOMMENDED OPERATING CONDITIONS

PARAMETER

SYMBOL

RATINGS

UNIT

VCNTL Supply Voltage

VCNTL

4.5 ~ 6

VIN Supply Voltage

VIN

1.0 ~ 3.5

Output Voltage , VCNTL=5.0±5%

VOUT

0.8 ~ VIN-0.2

Output Current

IOUT

0 ~ 7

Junction Temperature

+125

°С

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