MD7IC21100NR1 MD7IC21100GNR1 MD7IC21100NBR1

21

RF Device Data

Freescale Semiconductor, Inc.

PRODUCT DOCUMENTATION AND SOFTWARE

Refer to the following documents and software to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

• AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages

• AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

• Electromigration MTTF Calculator

• RF High Power Model

For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &

Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Oct. 2008

• Initial Release of Data Sheet

1

June 2011

• Changed ESD Human Body Model rating from Class 1C to Class 0 to reflect recent ESD test results of the

device, p. 2

• Fig. 13, MTTF versus Junction Temperature removed, p. 8. Refer to the device’s MTTF Calculator

available at freescale.com/RFpower. Go to Design Resources > Software and Tools.

• Fig. 14, CCDF W--CDMA IQ Magnitude Clipping, Single--Carrier Test Signal and Fig. 15, Single--Carrier

W--CDMA Spectrum updated to show the undistorted input test signal, p. 8 (renumbered as Fig. 13 and

Fig. 14 after Fig. 13 removed)

• Added AN3789, Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages to

Product Documentation, Application Notes, p. 21

• Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,

p. 21

2

Feb. 2012

• Table 3, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD

ratings are characterized during new product development but are not 100% tested during production. ESD

ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive

devices, p. 2

• Corrected bias conditions throughout the data sheet to reflect the true testing methodology.

• Removed Fig. 5, Possible Circuit Topologies, and renumbered all subsequent figures, p. 5--10