STA369BW datasheet(84/88 Pages) STMICROELECTRONICS

84 / 88 page

Package thermal characteristics

STA369BW

84/88

Doc ID 022033 Rev 1

Package thermal characteristics

Using a four-layer PCB, the thermal resistance junction-to-ambient with 2 copper ground

areas of 6 x 4 cm2 and with 24 via holes (see Figure 35) is 17 °C/W in natural air convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

Thus, the maximum estimated dissipated power for the STA369BW is:

Figure 35.

Double-layer PCB with 2 copper ground areas and 24 via holes

Figure 36 shows the power derating curve for the PowerSSO-36 slug-down package on

PCBs with copper areas of 5 x 4 cm2 and 6 x 4cm2.

Figure 36.

PowerSSO-36 power derating curve

2 x 40 W @ 8

Ω, 25.5 V

Pd max ~ 8 W

2 x 17 W + 1 x 35 W @ 4

Ω, 8 Ω, 25 V

Pd max < 7 W

AM045200v1

020

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 5x4 cm

and 20 via holes

STA350BW

Power-SSO36

Copper Area 6x4 cm

and 24 via holes

Copper Area 5x4 cm

and 20 via holes

STA369BW

Power-SSO36

Copper Area 6x4 cm

and 24 via holes

AM045201v1

STA369BW Datasheet(PDF) 84 Page - STMicroelectronics

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