STPS2H100

Characteristics

Doc ID 6115 Rev 7

5/10

Figure 17.

Thermal resistance junction to ambient versus copper surface under each lead

(SMB flat)

Figure 13.

Forward voltage drop versus

forward current (low level)

Figure 14.

Forward voltage drop versus

forward current (high level)

I

(A)

FM

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

V

(V)

FM

I

(A)

FM

1

10

100

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

V

(V)

FM

Figure 15.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

Figure 16.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMB)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S

(cm²)

CU

SMA

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S

(cm²)

CU

SMB

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S

(cm²)

CU

SMB flat

Epoxy printed circuit board FR4,

Copper thickness = 35 µm