Package information

DCPL-WB-00D3

8/11

Doc ID 17967 Rev 1

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 11.

Package dimensions

Figure 12.

Footprint

Figure 13.

Marking

Ø255µm +/-40µm

LB Path

HB Path

GND

LB in

LB out

GND

HB in

HB out

A1

A2

A3

B1

C1

C2

C3

B3

LB Path

HB Path

GND

LB in

LB out

GND

HB in

HB out

A1

A1

A2

A2

A3

A3

B1

B1

C1

C1

C2

C2

C3

C3

B3

B3

LB Path

HB Path

GND

LB in

LB out

GND

HB in

HB out

A1

A2

A3

B1

C1

C2

C3

B3

GND

LB in

LB out

GND

HB in

HB out

A1

A1

A2

A2

A3

A3

B1

B1

C1

C1

C2

C2

C3

C3

B3

B3

1.67mm +/- 50µm

632 µm

Copper pad diameter:

220 µm recommended

Solder stencil opening:

220 µm recommended

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

ECOPACK status

xx = marking

z = manufacturing

location

yww = datecode

(y = year

ww = week)