M24C32-W_12 datasheet(37/40 Pages) STMICROELECTRONICS

37 / 40 page

M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF

Package mechanical data

Doc ID 4578 Rev 21

37/40

Figure 17.

UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package

outline

Drawing is not to scale.

The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 23.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.550

0.450

0.600

0.0217

0.0177

0.0236

0.020

0.000

0.050

0.0008

0.0000

0.0020

0.250

0.200

0.300

0.0098

0.0079

0.0118

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

1.200

1.600

0.0472

0.0630

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

1.200

1.600

0.0472

0.0630

0.500

0.0197

K (rev MC)

0.300

0.0118

0.300

0.500

0.0118

0.0197

0.150

0.0059

0.300

0.0118

eee(2)

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080

0.0031

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