M93C86_11 datasheet(33/34 Pages) STMICROELECTRONICS

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M93C46, M93C56, M93C66, M93C76, M93C86

Revision history

Doc ID 4997 Rev 12

33/34

31-Jul-2007

Document reformatted. TSSOP8 3 × 3 mm (DS) package removed.

Erase/Write Enable (EWEN) instruction replaced by Write Enable

(WEN). Erase/Write Disable (EWDS) instruction replaced by Write

Disable (WDS).

Section 7: Initial delivery state modified, ACTIVE POWER AND

STANDBY POWER MODES section removed.

ICC1 test conditions modified in Table 15, Table 16, Table 17, Table 18

and Table 19. Note 1 added to Table 15.

tW parameter description modified in Table 20, Table 21, Table 22 and

Table 23.

SO8 narrow and UFDFPN8 package specifications updated (see

Section 12: Package mechanical data).

Table 29, Table 30, Table 31, Table 32 and Table 33 added.

Blank option removed under Plating technology in Table 27: TSSOP8 –

8 lead thin shrink small outline, package mechanical data.

Section 2: Connecting to the serial bus added. Device grade 7 removed.

29-Jan-2008

Small text changes.

M93C76-R root part number added.

Section 2: Connecting to the serial bus modified (pull-down resistor

added to Figure 3: Bus master and memory devices on the serial bus

and paragraph added).

Section 3.1.2: Power-up conditions corrected.

TLEAD modified in Table 8: Absolute maximum ratings.

VOH min guaranteed at a higher value in DC characteristics tables 15,

16, 17 and 18.

M93C56-R is also offered in TSSOP8 package (see Table 30).

Package mechanical inch values calculated from mm and rounded to 4

decimal digits in Section 12: Package mechanical data

TSSOP8 (DW) package specifications updated.

01-Apr-2010

Modified footnote in Table 15 and Table 16 on page 21

Updated Figure 14: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual

flat package no lead 2 x 3 mm, outline and Table 26: UFDFPN8 (MLP8)

8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data

29-Apr-2010

Updated Figure 31: Available M93C66-x products (package, voltage

range, temperature grade) UFDFPN option.

12-Apr-2011

Updated Table 8: Absolute maximum ratings, MLP8 package data in

Section 12: Package mechanical data and process data in Section 9:

Clock pulse counter.

Deleted Table 29: Available M93C46-x products (package, voltage

range, temperature grade), Table 30: Available M93C56-x products

(package, voltage range, temperature grade), Table 31: Available

M93C66-x products (package, voltage range, temperature grade),

Table 32: Available M93C76-x products (package, voltage range,

temperature grade) and Table 33: Available M93C86-x products

(package, voltage range, temperature grade).

05-Oct-2011

Updated Table 1: Device summary and Table 9: Operating conditions

(M93Cx6).

Modified footnote 2 in Table 8.

Table 29.

Document revision history (continued)

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