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RT7247B Datasheet(PDF) 13 Page - Richtek Technology Corporation |
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RT7247B Datasheet(HTML) 13 Page - Richtek Technology Corporation |
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13 / 15 page ![]() RT7247B 13 DS7247B-01 September 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Figure 8. Derating Curve of Maximum Power Dissipation (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm 2 , θJA = 54°C/W 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 Ambient Temperature (°C) Copper Area 70mm 2 50mm 2 30mm 2 10mm 2 Min.Layout Four-Layer PCB The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 8 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm 2 , θJA = 49°C/W Figure 7. Thermal Resistance vs. Copper Area Layout Design |
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