RT8293B datasheet(13/14 Pages) RICHTEK

13 / 14 page

RT8293B

DS8293B-03

March 2011

www.richtek.com

(d) Copper Area = 50mm

2 ,

θJA = 51°C/W

(e) Copper Area = 70mm

2 ,

θJA = 49°C/W

Figure 6. Themal Resistance vs. Copper Area Layout Design

Figure 8. PCB Layout Guide

Table 3. Suggested Capacitors for CIN and COUT

Location

Component Supplier

Part No.

Capacitance (

µF)

Case Size

CIN

MURATA

GRM31CR61E106K

1206

CIN

TDK

C3225X5R1E106K

1206

CIN

TAIYO YUDEN

TMK316BJ106ML

1206

COUT

MURATA

GRM31CR60J476M

1206

COUT

TDK

C3225X5R0J476M

1210

COUT

MURATA

GRM32ER71C226M

1210

COUT

TDK

C3225X5R1C22M

1210

Layout Consideration

For best performance of the RT8293B, the follow layout guidelines must be strictly followed.

}

Input capacitor must be placed as close to the IC as possible.

}

SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace.

}

The feedback components must be connected as close to the device as possible

VIN

VOUT

GND

VOUT

COUT

Input capacitor must

be placed as close

to the IC as possible.

SW should be connected to inductor by

wide and short trace. Keep sensitive

components away from this trace.

The feedback components

must be connected as close

to the device as possible.

BOOT

VIN

GND

COMP

GND

CSS

RS* CS*

GND

VIN

REN

CIN

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