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AD73322AST Datasheet(PDF) 10 Page - Analog Devices |
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AD73322AST Datasheet(HTML) 10 Page - Analog Devices |
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10 / 43 page  AD73322 –10– REV. B ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V Digital I/O Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . +150 °C SOIC, θ JA Thermal Impedance . . . . . . . . . . . . . . . 71.4 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C LQFP, θ JA Thermal Impedance . . . . . . . . . . . . . . . 53.2 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Temperature Package Package Model Range Descriptions Options AD73322AR –40 °C to +85°C Wide Body SOIC R-28 AD73322AST –40 °C to +85°C Plastic Thin Quad ST-44A Flatpack (LQFP) EVAL-AD73322EB Evaluation Board 1 +EZ-KIT Lite Upgrade 2 EVAL-AD73322EZ Evaluation Board 1 +EZ-KIT Lite 3 NOTES 1The AD73322 evaluation board features a selectable number of codecs in cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or to a Texas Instruments EVM kit. 2The upgrade consists of a connector that is used to connect the EZ-KIT to the AD73322 evaluation board. This option is intended for owners of the EZ-KIT Lite. 3The EZ-KIT Lite has been modified to allow it to interface with the AD73322 evaluation board. This option is intended for users who do not already have an EZ-KIT Lite. PIN CONFIGURATIONS 28-Lead Wide Body SOIC (R-28) TOP VIEW (Not to Scale) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AD73322 SDO MCLK SCLK RESET DVDD DGND AGND2 VINP1 VFBP1 VINN1 VFBN1 AVDD2 REFCAP REFOUT SDOFS SDIFS SDI SE AGND1 AVDD1 VOUTP2 VFBN2 VINN2 VFBP2 VINP2 VOUTN2 VOUTP1 VOUTN1 44-Lead Plastic Thin Quad Flatpack (LQFP) (ST-44A) 3 4 5 6 7 1 2 10 11 8 9 40 39 38 41 42 43 44 36 35 34 37 29 30 31 32 33 27 28 25 26 23 24 PIN 1 IDENTIFIER TOP VIEW (Not to Scale) 12 13 14 15 16 17 18 19 20 21 22 NC VOUTN1 VOUTP1 NC VOUTN2 VOUTP2 NC AD73322 REFOUT REFCAP AVDD2 AVDD2 AGND2 AGND2 AGND2 NC = NO CONNECT AGND2 DGND DGND DVDD AVDD1 AVDD1 AGND1 AGND1 |
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