ADSP-2104 datasheet(12/36 Pages) AD

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RECOMMENDED OPERATING CONDITIONS

K Grade

Parameter

Min

Max

Unit

VDD

Supply Voltage

4.50

5.50

TAMB

Ambient Operating Temperature

+70

°C

See “Environmental Conditions” for information on thermal specifications.

ELECTRICAL CHARACTERISTICS

Parameter

Test Conditions

Min

Max

Unit

VIH

Hi-Level Input Voltage

3, 5

@ VDD = max

2.0

VIH

Hi-Level CLKIN Voltage

@ VDD = max

2.2

VIL

Lo-Level Input Voltage

1, 3

@ VDD = min

0.8

VOH

Hi-Level Output Voltage

2, 3, 7

@ VDD = min, IOH = –0.5 mA

2.4

@ VDD = min, IOH = –100

µA8

VDD – 0.3

VOL

Lo-Level Output Voltage

2, 3, 7

@ VDD = min, IOL = 2 mA

0.4

IIH

Hi-Level Input Current

@ VDD = max, VIN = VDD max

µA

IIL

Lo-Level Input Current

@ VDD = max, VIN = 0 V

µA

IOZH

Three-State Leakage Current

@ VDD = max, VIN = VDD max

µA

IOZL

Three-State Leakage Current

@ VDD = max, VIN = 0 V

µA

Input Pin Capacitance

1, 8, 9

@ VIN = 2.5 V, fIN = 1.0 MHz, TAMB = 25

°C8

Output Pin Capacitance

4, 8, 9, 10

@ VIN = 2.5 V, fIN = 1.0 MHz, TAMB = 25

°C8

NOTES

1Input-only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR1, DR0.

2Output pins: BG, PMS, DMS, BMS, RD, WR, A0–A13, CLKOUT, DT1, DT0.

3Bidirectional pins: D0–D23, SCLK1, RFS1, TFS1, SCLK0, RFS0, TFS0.

4Three-state pins: A0–A13, D0–D23, PMS, DMS, BMS, RD, WR, DT1, SCLK1, RSF1, TFS1, DT0, SCLK0, RFS0, TFS0.

5Input-only pins: RESET, IRQ2, BR, MMAP, DR1, DR0.

60 V on BR, CLKIN Active (to force three-state condition).

7Although specified for TTL outputs, all ADSP-2104/ADSP-2109 outputs are CMOS-compatible and will drive to V

DD and GND, assuming no dc loads.

8Guaranteed but not tested.

9Applies to PGA, PLCC, PQFP package types.

10Output pin capacitance is the capacitive load for any three-stated output pin.

Specifications subject to change without notice.

ADSP-2104/ADSP-2109–SPECIFICATIONS

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADSP-2104/ADSP-2109 processor features proprietary ESD protection circuitry to dissipate

high energy electrostatic discharges (Human Body Model), permanent damage may occur to devices

subjected to such discharges. Therefore, proper ESD precautions are recommended to avoid

performance degradation or loss of functionality. Unused devices must be stored in conductive foam

or shunts, and the foam should be discharged to the destination socket before the devices are

removed. Per method 3015 of MIL-STD-883, the ADSP-2104/ADSP-2109 processor has been

classified as Class 1 device.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V

Output Voltage Swing . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V

Operating Temperature Range (Ambient) . . . –55ºC to +125

°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +125°C

Lead Temperature (10 sec) PGA . . . . . . . . . . . . . . . . . +300

°C

Lead Temperature (5 sec) PLCC, PQFP, TQFP . . . . +280

°C

*Stresses greater than those listed above may cause permanent damage to the

device. These are stress ratings only, and functional operation of the device at these

or any other conditions greater than those indicated in the operational sections of

this specification is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

WARNING!

ESD SENSITIVE DEVICE

–12–

REV. 0

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