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DFM100PXM33-F000 Datasheet(PDF) 2 Page - Dynex Semiconductor

Part # DFM100PXM33-F000
Description  Fast Recovery Diode Module
PDF  6 Pages
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Manufacturer  DYNEX [Dynex Semiconductor]
Direct Link  http://www.dynexsemi.com
Logo DYNEX - Dynex Semiconductor

DFM100PXM33-F000 Datasheet(HTML) 2 Page - Dynex Semiconductor

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ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
Tcase = 25°C unless stated otherwise
Symbol
Parameter
Test Conditions
Max.
Units
VRRM
Repetitive peak reverse voltage
Tj = 125°C
3300
V
IF
Forward current (per arm)
DC, Tcase = 70°C
100
A
IFM
Max. forward current (per arm)
Tcase = 105°C, tp = 1ms
200
A
I
2t
I
2t value fuse current rating
VR = 0, tp = 10ms, Tj = 125°C
5
kA
2s
Pmax
Max. power dissipation
Tcase = 25°C, Tj = 125°C
521
W
Visol
Isolation voltage
– per module
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
6000
V
QPD
Partial discharge
– per module
IEC1287, V1 = 3500V, V2 = 2600V, 50Hz RMS
10
pC
VRRM DC
DC Voltage stability
25°C at sea level, 100 FITs
2200
V
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
AlN
Baseplate material:
AlSiC
Creepage distance:
33mm
Clearance:
20mm
CTI (Comparative Tracking Index):
350
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Units
Rth(j-c)
Thermal resistance (per arm)
Continuous dissipation
–
junction to case
-
-
192
°C/kW
Rth(c-h)
Thermal resistance
–
case to heatsink (per module)
Mounting torque 5Nm
(with mounting grease)
-
-
16
°C/kW
Tj
Junction temperature
-40
-
125
°C
Tstg
Storage temperature range
-40
-
125
°C
Screw Torque
Mounting
– M6
-
-
5
Nm
Electrical connections
– M5
-
-
4
Nm



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