Rev. 00

Rev. 00

September 2010

September 2010

www.seoulsemicon.com

www.seoulsemicon.com

서식번호 : SSC-QP-7-07-24 (Rev.00)

9. soldering

Lead Solder

Pre-heat

120~150℃

Pre-heat time

120 sec. Max.

Peak-Temperature

240℃ Max.

Soldering time Condition

10 sec. Max.

Lead Free Solder

Pre-heat

150~200℃

Pre-heat time

120 sec. Max.

Peak-Temperature

260℃ Max.

Soldering time Condition

10 sec. Max.

Lead Solder

2.5~5 C / sec.

o

o

o

Pre-heating

120~150 C

120sec. Max.

60sec. Max.

Above 200 C

o

240 C Max.

10 sec. Max.

2.5~5 C / sec.

260 C Max.

10 sec. Max.

o

60sec. Max.

Above 220 C

120sec. Max.

Pre-heating

150~200

C

1~5 C / sec.

o

o

o

o

1~5 C / sec.

Lead-frame Solder

(1) Lead Solder

(2) Lead-Free Solder

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

(3) Hand Soldering conditions

Do not exceed 4 seconds at maximum 315ºC under soldering iron.

(4) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter, the picking up nozzle that does not affect the silicone

resign should be used.

(5) It is recommended that the customer use the nitrogen reflow method.

(6) Repairing should not be done after the LEDs have been soldered.

(7) Reflow soldering should not be done more than two times.

In the case of more than 24 hours passed soldering after first, LEDs will be damaged.